Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit

ABSTRACT

A semiconductor device connecting structure for connecting a semiconductor IC  7  onto a substrate  13.  A bonding layer  31  is placed between the substrate  13  and the semiconductor IC  7  to accomplish adhesion therein. This bonding layer includes an ACF  32  as a bonding material for joining said semiconductor IC  7  onto said substrate  13  and a space  33  formed within the ACF  32.  Even if the IC  7  deforms due to heat or the like, the deformation is absorbed by the space a  33,  whereupon the connecting conditions of bumps  28, 29  can not be unstable.

TECHNICAL FIELD

The present invention relates to a semiconductor device connectingstructure for connecting a semiconductor device onto a substrate (orboard), a liquid crystal display unit based upon the semiconductordevice connecting structure, and an electronic apparatus using-theliquid crystal display unit.

BACKGROUND ART

In recent years, liquid crystal display units for displaying visibleinformation have come into widespread use for electronic equipment suchas navigation systems, televisions, palm-top computers, electronicorganizers and portable telephones. In general, these liquid crystaldisplay units are constructed such that a liquid crystal driving IC,i.e., a semiconductor device, is connected to a liquid crystal panel andincidental parts such as a back light and a casing are mounted on theliquid crystal panel. This liquid crystal panel is commonly made in amanner that a liquid crystal is put in between at least two substratesfor the liquid crystal, and a polarizing plate, a color filter andothers are mounted when necessary.

Many kind of ways of the connection of the liquid crystal driving IC tothe liquid crystal panel have been considered, for example, connectingmethods based upon a COB (Chip On Board) method, a COG (Chip On Glass)method or the like. According to the COB method, the liquid crystaldriving IC is joined through the use of an ACF (Anisotropic ConductiveFilm) or other joining materials to an insulating substrate having awiring pattern thereon, and that insulating substrate is connectedthrough a heat seal or the like to the liquid crystal panel.

On the other hand, according to the COG method, the liquid crystaldriving IC is directly joined through the use of the ACF or the like toa glass substrate having electrode terminals. In both the COB method andthe COG method, a semiconductor device such as the liquid crystaldriving IC is connected onto the substrate such as the insulatingsubstrate and the liquid crystal glass substrate.

In the above-mentioned prior connecting methods, the ACF or otherjoining materials are uniformly placed in between the substrate and theliquid crystal driving IC without making a space therein. For thisreason, when the liquid crystal driving IC is joined thereto underpressure, warps take place on the IC itself, or when the liquid crystaldriving IC and/or the substrate deform due to the variation oftemperature, excessive stresses occur at the bump portions of the liquidcrystal driving IC in direct contact with the electrodes on thesubstrate. As a result, the electrical connecting conditions can becomeunstable. In addition, for avoiding such problems, the pressure-joiningconditions for the liquid crystal driving IC are required to be severelymanaged within a small tolerance. As a result, a complicated processmanagement is demanded.

Moreover, in the Japanese Unexamined Patent Publication No. 2-42738,there has been disclosed a connecting structure in which, in a COB basedpackaged printed-circuit board, a flexible bonding layer is placed as acushioning material between an IC chip and A substrate to improve thereliability of the bond. However, in the case of this prior connectingstructure, it is required to provide the flexible bonding layer forexclusive use for the purpose of taking the cushioning action, whichleads to higher component cost and manufacturing cost.

Accordingly, the present invention has been developed with a view toeliminating the problems which arise with the prior semiconductor deviceconnecting structure. The object of this invention is to maintainsteadily the connecting condition of a semiconductor device to asubstrate only by adding an extremely simple construction.

DESCRIPTION OF THE INVENTION

For the purpose described above, in accordance with the presentinvention, in a semiconductor device connecting structure for joining asemiconductor device onto a substrate according to this invention, thereis a bonding layer in between the substrate and the semiconductor devicefor adhesion of both of them. The bonding layer contains a bondingmaterial for joining the semiconductor device to the substrate and aspace(s) formed in the interior of the bonding material.

According to this connecting structure, the space(s) is specially madein the bonding material when conducting the adhesion between thesemiconductor device and the substrate, and absorb the deformation ofthe semiconductor device and others, changing freely in shape inresponse to the deformation of the substrate or the semiconductordevice. In consequence, even in the case of the deformation of thesemiconductor device or the substrate, it is possible to preventexcessive loads from applying on the electrode portions of thesemiconductor device, so that the electrical connecting condition of thesemiconductor device can be maintained steadily in good condition.

The space(s) is formed in the bonding material by pressurizing an ICwith a pressurizing head ahd by heating at the same time as describedbelow. When the temperature of the pressurizing head is given to thebonding material, the viscosity of the bonding material rapidlydecreases to flow out to the external. In this way the space(s)can beformed. Thus, by forming the space(s) in the bonding material, it ispossible to relieve the deformation of the semiconductor device or thesubstrate.

In the structure described above, as the semiconductor device, an ICchip and an LSI chip can be considered. Further, when supposing a liquidcrystal display unit, as the semiconductor device, a liquid crystaldriving IC can be considered. As the substrate, an insulating substratein the COB method, a transparent substrate for a liquid crystal in theCOG method, and various substrates corresponding to other connectingmethods can be considered. As the bonding material, an ACF (AnisotropicConductive Film) and a common bonding material can be considered.

The ACF is produced by dispersing conductive particles into athermoplastic film or a thermosetting resin film, and is a bondingmaterial showing the conductivity in a single direction by receiving thethermocompression bonding.

On the other hand, the common bonding materials have a function to joina semiconductor device to a substrate only mechanically, notelectrically.

In the case of using the ACF, the terminals on the substrate and thebumps of the semiconductor device are electrically coupled through theconductive particles to each other. On the contrary, in the case ofusing the common bonding material, the terminals on the substrate andthe bumps of the semiconductor device are directly connected toestablish an electrical conduction, and in this state, the semiconductordevice is mechanically joined to the substrate by the common bondingmaterial.

Considering the liquid crystal driving IC to be used for a liquidcrystal display unit as the semiconductor device, a plurality of bumpsare arranged in rows on an active surface of the liquid crystal drivingIC. Various ways can be considered for that in-row arrangement. Forinstance, as shown in FIGS. 2 and 7, a pair of bump strings 28, 29arranged in rows (two rows in the illustrations) in the longitudinaldirection and a pair of bump strings 28, 28 arranged in rows (two rowsin the illustrations) in the transverse direction are arranged in aring-shape. Further, as shown in FIG. 8, a pair of bump strings 28, 29may be located only in the longitudinal direction or in the transversedirection.

For the connection of the semiconductor device with the foregoing bumparrangement onto the substrate, as shown in FIG. 2, spaces 33 are formedin an adhesive (bonding material) within an area surrounded by thering-shaped arranged bumps, or as shown in FIG. 7, spaces 33 are formedbetween the respective bumps 28, 29 or outside the bump strings.

The spaces to be formed inside the adhesive can be made as a singlespace with a large volume, or can be made by disposing a plurality ofspaces with small volumes in mutually close conditions.

Preferably, the space rate to the adhesive assumes between 5% and 70%,more preferably between 10% and 30%. This is because, in the case thatthe space rate is below 5%, it is impossible to absorb the deformation(or stress) of the semiconductor device or the substrates On thecontrary, when it assumes more than 70%, the reliability of theconnection between the semiconductor device and the substrate(particularly, the terminals formed on the substrate) goes down.Accordingly, if the space(s) is formed at the rate of 5% to 70%, theconnection reliability can be obtained. More preferably, if the spacerate is set to between 10% and 30%, the structure with improvedconnection reliability can be formed.

The bonding layer is made of an epoxy-based adhesive. Further, thisbonding layer absorbs the deformation of the semiconductor device or thesubstrate.

Furthermore, in accordance with the present invention, a feature of aconnecting method of joining a semiconductor device onto a substrate isthat a bonding layer is placed in between the substrate and thesemiconductor device to join them to each other, and a pressurizing headheated up to a high temperature is pressed against the semiconductordevice to pressurize and heat the mentioned bonding layer for joiningthe substrate to the semiconductor device, and a space(s) is formed inthe mentioned bonding layer. With this construction, the deformation ofthe semiconductor device or the substrate can be reduced by the space(s)and a connecting structure with a higher reliability can be obtained. Inaddition, the bonding layer is made from an epoxy-based adhesive.

A liquid crystal display unit according to this invention is a liquidcrystal display unit with the above-described semiconductor deviceconnecting structure. In more detail, the liquid crystal display unitaccording to this invention is composed of a pair of substrates disposedin an opposed relation to each other to interpose a liquid crystaltherein, a semiconductor device joined onto at least one of thesubstrates and a liquid crystal display apparatus with a bonding layerplaced in between the substrate and the semiconductor device to join thesemiconductor device to the substrate wherein the bonding layer containsan adhesive for adhering the semiconductor device to the liquid crystalholding substrate and a space(s) made in the interior of the adhesive.

As mentioned above, it is preferable that the space rate to the adhesiveis set to reach 5% to 70%, more preferably 10% to 30%, so that thesemiconductor device and the electrode terminals formed on the substratecan be connected with a high reliability.

Moreover, concrete examples of an electronic apparatus using a liquidcrystal display unit according to this invention are various kinds ofequipment such as a navigation system, a television, a palm-topcomputer, an electronic organizer and a portable telephone. Morespecifically, one of the examples is the electronic apparatus withoutput terminals for driving a plurality of semiconductors, a liquidcrystal display unit connected to these output terminals for driving asemiconductor, and an input unit. The liquid crystal display unitincludes a pair of substrates disposed in an opposed relation to eachother to interpose a liquid crystal therein, a semiconductor devicejoined onto at least one of the liquid crystal holding substrates, and abonding layer placed in between the liquid crystal holding substrate andthe semiconductor device to join the semiconductor device to thesubstrates for liquid crystal. In this case, the bonding layer containsan adhesive for adhering the semiconductor device to the substrates forliquid crystal and a space(s) made in the interior of the adhesive.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view showing an embodiment of asemiconductor device connecting structure according to the presentinvention;

FIG. 2 is a plan view showing a joining portion of a semiconductordevice at arrow A in FIG. 1;

FIG. 3 is a side elevational cross-sectional view showing an embodimentof a liquid crystal display unit according to this invention;

FIG. 4 is an exploded perspective view of a liquid crystal display unitshown in the FIG.1;

FIG. 5 is a perspective view showing one example of elastic connectorsfor electrically connecting a liquid crystal display unit to anothercircuit inside of an electronic apparatus;

FIG. 6 is an exploded perspective view showing a portable telephonewhich is an embodiment of electronic apparatus according to anembodiment of this invention;

FIG. 7 is a plan view showing a modification of a way of forming spaceson an adhesive; and

FIG. 8 is a plan view showing a modification of a bump arrangement on asemiconductor device.

DESCRIPTION OF THE BEST MODE OF CARRYING OUT THE INVENTION

FIG. 6 shows a portable telephone as one example of electronic apparatususing a liquid crystal display unit according to an embodiment of thepresent invention. This portable telephone is equipped with an upperhousing 1 and a lower housing 2. The upper housing 1 includes a PCB(Printed Circuit Board) for controlling a keyboard 10. In addition, thelower housing 2 includes a control circuit board 3 mounting a controlLSI and a body board 4 mounting the circuit board 3. A liquid crystaldisplay unit 5 according to this invention is mounted on the body board4. A plurality of semiconductor driving output terminals 6 are formed asa wiring pattern on the surface of the body board 4. The liquid crystaldisplay unit 5 has a liquid crystal driving IC 7, i.e., a semiconductordevice, therein. The liquid crystal driving IC 7 is electricallyconnected to the semiconductor driving output terminals 6 with theliquid crystal display unit 5 mounted on the body board 4. The liquidcrystal display unit 5 and other necessary units are placed within thelower housing 2 and subsequently the upper housing 1 is placed thereonfrom above. In this way a portable telephone is completed. Incidentally,numeral 20 designates a speaker.

For instance, as shown in FIG. 4, the liquid crystal display unit 5includes a liquid crystal panel 8, a back light unit 9, a shielded case11 and an elastic connector 12. The liquid crystal panel 8 includes, asshown in FIG. 3, a first liquid crystal holding substrate 13 made of atransparent glass and a second liquid crystal holding substrate 14 madeof a transparent glass. A transparent electrode 18 is formed on an innersurface of the first liquid crystal holding substrate 13, whereas atransparent electrode 19 is formed on an inner surface of the secondliquid crystal holding substrate 14. Both electrodes are made of an ITO(Indium Thin Oxide) and another transparent conductive material.

Furthermore, polarizing plates 16 a, 16 b, serving as polarizing means,are adhered to outer surfaces of the first and second liquid crystalholding substrates 13, 14, respectively. The first liquid crystalholding substrates 13 and second liquid crystal holding substrates 14are joined in a liquid-proof condition to each other by a ring-likesealing compound 17 with a certain gap, so-called cell gap. Further, aliquid crystal is sealed in the cell gap. A semiconductor input terminal21 is formed at a right-hand end portion on an inner surface of asection 13 a of the first liquid crystal holding substrate 13 protrudingtoward the exterior (the right side in FIG. 3) of the second liquidcrystal holding substrate 14. The liquid crystal driving IC 7 as asemiconductor device is directly adhered by a bonding layer 31 onto thefirst liquid crystal holding substrate 13, whereupon an output bump 28of the IC 7 is connected to the transparent electrode 18 while an inputbump 29 of the IC 7 is connected to the semiconductor input terminal 21.

Thus, this embodiment provides a liquid crystal display unit, that is, aCOG (Chip On Glass) type liquid crystal display unit, where the liquidcrystal driving IC 7 is directly joined to the liquid crystal holdingsubstrate 13 constituting the liquid crystal panel 8.

In FIG. 3, the back light unit 9 comprises a light guiding member 22 anda plurality of (for example, 4) LEDs (Light Emitting Diodes) 23 fixed toa left-hand end portion of the light guiding member 22. Also, as shownin FIG. 4, a rectangular-parallelepiped-like guide hole 24 serving as aguide for the elastic connector 12 is made in a right-hand end portionof the light guiding member 22. As shown in FIG. 3, this guide hole 24is made to have a dimension accepting the elastic connector 12 withoutmaking a gap.

The elastic connector 12 is, as shown in FIG. 5, equipped with anelastic material with an electrical insulation, for example, an elasticproximal section 25 made of a silicone rubber to have a cross-sectionalsemi-circular column-like configuration, and a large number ofconductive sections 26 provided in parallel to each other on asemi-circular outer circumferential surface of the elastic proximalsection 25. An elastic material is placed between the two conductivesections adjacent to each other to form a non-conductive section. Thewidth of the non-conductive section is kept to be 15 μm to 25 μm. In theillustration, reference mark W represents the separation between theadjacent conductive section 26, so-called inter-conductive-sectionpitch, which is commonly set to W=30 μm to 50 μm.

For mounting the liquid crystal display unit according to thisembodiment on the body board 4 of the portable telephone (FIG. 6), inFIG. 4, the elastic connector 12 is inserted into the guide hole 24 inthe light guiding member 22, and the back light unit 9 is placed at agiven position on the body board 4, and the liquid crystal panel 8 isplaced at a given position on the back light unit 9, and the shieldedcase 11 is put on the liquid crystal panel 8 and the back light unit 9in a state where a pressurizing member 30 made of a silicone rubber oranother elastic material is interposed therein. And further, as shown inFIG. 3, the body board 4 and the shielded case 11 are tightened andfixed to each other by deforming a caulking stopper 27.

At this time, the elastic connector 12 is compressed and deformedelastically in the vertical direction due to the effect of thepressurizing member 30, whereupon the conductive sections 26 (see FIG.5) firmly comes into contact with both the semiconductor input terminal21 on the liquid crystal panel 8 side and the semiconductor drivingoutput terminal 6 on the body board 4 side owing to the elasticrestoring force of the elastic proximal section 25.

Incidentally, in terms of the way of compressing the elastic connector12, it is also possible that, in place of preparing a dedicatedcomponent such as the pressurizing member 30, the corresponding portionof the shielded case 11 is deformed to protrude inwardly to form a ribat that portion of the shielded case 11 so that the rib compresses theelastic connector 12.

On the completion of the above-mentioned liquid crystal display unitattachment, an electric signal and a liquid crystal driving power aresupplied from the control circuit board 3 (FIG. 6), through thesemiconductor driving output terminal 6, the elastic connector 12 (FIG.3) and the semiconductor input terminal 21, to the liquid crystaldriving IC 7. According to that, the liquid crystal driving IC 7controls the applied voltages to the electrodes 18, 19. Due to thisvoltage control, a visible image appears on an effective display regionof the liquid crystal panel 8.

In this embodiment, since only by disposing the elastic connector 12between the semiconductor input terminal 21 on the liquid crystal panel8 side and the semiconductor driving output terminal 6 on the portabletelephone side, both of them can be electrically connected to eachother, the assembling work becomes extremely easy. In addition, sincethe elastic connector 12 is put within the guide hole 24, when a forceworks on the elastic connector 12, the elastic connector 12 warpswithout deformation such as buckling. Therefore, the electricalconnecting condition between the semiconductor input terminal 21 and thesemiconductor driving output terminal 6 can always be maintainedsteadily.

In this embodiment, as shown in FIG. 1, the liquid crystal driving IC 7is adhered onto the first liquid crystal substrate 13 by the bondinglayer 31. The bonding layer 31 is composed of an ACF (AnisotropicConductive Film) 32 serving as an adhesive and a plurality of spaces 33formed inside of the ACF 32. The ACF 32 is formed by dispersing a largenumber of conductive particles 34 into an adhesive-property resin film,and the output bump 28 of the IC 7 is electrically connected through theconductive particles 34 to the transparent electrode 18, whereas theinput bump 29 is electrically connected through the conductive particles34 to the semiconductor input terminal 21. Further, the bump 28, thebump 29 and the portions between the terminals are held in a insulatedcondition by an adhesive-property resin.

FIG. 2 shows the joining portion of the liquid crystal driving IC 7viewed from the direction indicated by an arrow A in FIG. 1. Obviouslyfrom the illustration, the plurality of spaces 33 are positioned to beclose to each other within an area surrounded by the bumps 28, 29arranged in two rows in the longitudinal direction and the bumps 28, 28arranged in two rows in the transverse direction, that is, within anarea surrounded by the plurality of bumps 28, 29 arranged to make aring-like configuration. Incidentally, although FIG. 2 is illustratedwith the bumps 28 and 29 omitted, bumps are formed at thecircumferential end portions of the substrates as well as illustrated.

In general, for joining the liquid crystal driving IC 7 onto thesubstrate 13, the liquid crystal driving IC 7 is heated and pressedagainst the substrate 13 under a given pressure with the ACF 32interposed between the IC 7 and the substrate 13. In this case,preferably, the ACF 32 is made of an epoxy-based adhesive. Particularly,if it is formed with a molecule including an epoxy radical at arelatively. small molecular weight, an excellent adhesive property canbe obtained.

At this heating and pressurizing processing, the liquid crystal drivingIC 7 may warp, and when it warps, an excessive stress may occur in theconnecting portions of the bumps 28 and 29, causing the electricallyconnecting condition to be unstable. Further, when the temperaturevaries in the liquid crystal driving IC 7, the IC 7 and/or the substrate13 may deform, causing the connecting conditions of the bumps 28 and 29to be unstable.

On the other hand, if the spaces 33 are provided inside the ACF 32 likethis embodiment, when the liquid crystal driving IC 7 deforms, thespaces 33 freely can deform in accordance with the deformation of IC7and can absorb the deformation of the IC 7. As a result, the excessivestress on the connecting portions of the bumps 28, 29 can be prevented.

The way of forming the spaces 33 inside of the ACF 32 is not limited toa specific method. For example, if the pressure bonding condition forjoining the liquid crystal driving IC 7 onto the substrate 13 is set toan appropriate condition for the liquid crystal driving IC to be used,the spaces 33 can be produced. The following requirements are listed asone example of the pressure-bonding condition.

(1) liquid crystal driving IC 7: SED1220 (manufactured by Seiko EpsonCo., Ltd.)

In FIG. 2, this IC has a dimension of L×W=7.7 mm×2.8 mm, and the numberof bumps is approximately 200 and the bump size is 80 μm ×120 μm.

(2) ACF 32: CP8530 (manufactured by Sony Chemical Co., Ltd.)

(3) Heating temperature of ACF: 180 to 230° C. (central temperature=200to 210° C.)

In the case that the ACF is pressurized and heated by pressing the IC 7with the pressurizing head heated up to a high temperature, if thetemperature of the pressurizing head is set to 260 to 360° C. (centraltemperature=approximately 300° C.), the aforesaid ACF temperature can beobtained.

(4) Pressurizing force of pressurizing head: 12 kgf to 20 kgf

(5) Pressurizing time of pressurizing head: 10 seconds

When the liquid crystal driving IC 7 was joined to the substrate 13under the aforesaid (1) to (5) requirements, the plurality of spaces 33shown in FIG. 2 were formed inside the ACF 32.

These spaces are formed in the ACF when, in the heating and pressurizingprocessing, the viscosity of the adhesive rapidly decreases at theinitial-process heating (process for approximately 0.1 to 0.5 second) sothat a portion of the bonding layer flows out toward the exterior of thesemiconductor device. The space rate to the ACF is preferable to be in arange of 5% to 70%. This is because, in the case that the space rate isbelow 5%, the stress on the ACF can not be absorbed. On contrary, whenthe space rate exceeds 70%, the space rate is too high to connect theterminals (or the electrodes) to each other with a high reliability.Accordingly, the space rate is preferable to be set in this range.However, in order to connect with a particularly high reliability, it ispreferable that the space rate is set in a range of 10% to 30%. When thespace rate is set to be in this range, the internal stress can bereduced without losing the adhesion strength, connecting with a highreliability.

FIG. 7 shows a modification of the method of making the spaces 33. Thedifference of this modification from the above-described embodimentshown in FIG. 2 is that, in addition to providing the spaces 33 betweenthe bump strings 28, 29 in the longitudinal direction and between thebump strings 28, 28 in the transverse direction, the spaces 33 areformed between the respective bumps and outside the pair of bumpstrings. Even in the case of disposing the spaces 33 in this way, theconnection of the semiconductor devices to the substrate can bemaintained steadily. Incidentally, although FIG. 7 is illustrated withthe bumps 28 and 29 omitted, bumps are formed around the end portions ofthe substrate as well as the illustrated bumps 28 and 29. Alternate longand short dash lines indicates the bumps. Likewise, FIGS. 8 and 2 areillustrated with the bumps omitted, but the same bumps as theillustrated bumps 28, 29 are formed around the substrate end portions.

FIG. 8 shows a modification of the bump arrangement. The difference ofthis modification from the above-described embodiment shown in FIG. 2 isthat, instead of arranging the plurality of bumps 28, 29 to make aring-like configuration, the bumps are disposed in rows only in thelongitudinal direction. In this modification, a plurality of spaces 33are provided between the bump strings 28, 29. However, instead of or inaddition to these spaces, the spaces 33 can also be provided between therespective bumps and/or outside the bump strings.

The present invention has been described with some preferredembodiments, but this invention is not limited to those embodiments, andincludes various changes within the technical ranges described in theclaims.

For instance, the semiconductor connecting structure and the liquidcrystal display unit according to this invention are applicable tovarious electronic apparatus other than a portable telephone, such as anavigation system, a television, a palm-top computer and an electronicorganizer, which require a visible information display.

FIGS. 3 to 5 indicate the embodiments which this invention is applied tothe COG (Chip On Glass) type liquid crystal display unit. However, thisinvention is also applicable to the other types of liquid crystaldisplay units, for example, a COB (Chip On Board) type liquid crystaldisplay unit.

Furthermore, in the embodiments shown in FIGS. 3 to 5, the outputterminal 6 on the portable telephone side as an electronic apparatus andthe input terminal 21 on the liquid crystal panel 8 side areelectrically connected to each other by the elastic connector 12.However, the connecting method for connecting both of them is notlimited to this. For example, this invention-includes a case ofconnecting both terminals by using an FPC (Flexible Printed Circuit).

Still further, in the embodiment shown in FIG. 1 the bonding layer 31 isconstructed with the ACF 32 containing the conductive particles 34.Instead, it can be made by using an adhesive which does not containconductive particles. In this case, spaces 33 are formed inside theadhesive. In addition, in this case, the bumps for the liquid crystaldriving IC 7 are directly connected to the electrode terminals on theliquid crystal panel side.

1. A semiconductor device connecting structure for connecting asemiconductor device onto a substrate, comprising; a bonding layerinterposed between said semiconductor device and said substrate toaccomplish adhesion therebetween, which includes a bonding material foradhering said semiconductor device onto said substrate and a pluralityof amoebiform spaces substantially free from solids and liquids, formedwithin said bonding material, wherein said plurality of amoebiformspaces are formed closely to each other and span from said semiconductordevice to said substrate; and wherein said spaces chance shape inresponse to deformation of at least one of said substrate and saidsemiconductor device.
 2. A semiconductor device connecting structure asdefined in claim 1, wherein said semiconductor device includes aplurality of bumps arranged in rows, and said plurality of spaces areformed between said bump rows, outside said bump rows and between saidbumps, or at least within at least one of the areas therein.
 3. Asemiconductor device connecting structure as defined in claim 1, whereinsaid bonding material is an anisotropic conductive film includingconductive particles dispersed into a resin film.
 4. A semiconductordevice connecting structure as defined in claim 1, wherein said bondinglayer is made of an epoxy-based bonding material.
 5. The semiconductordevice connecting structure for connecting a semiconductor device onto asubstrate as defined in claim 1, wherein said plurality of amoebiformspaces are adjacent to each other.
 6. A semiconductor device connectingstructure for connecting a semiconductor device onto a substrate,comprising; a bonding layer interposed between said semiconductor deviceand said substrate to accomplish adhesion therebetween, which includes abonding material for adhering said semiconductor device onto saidsubstrate and a plurality of amoebiform spaces substantially free fromsolids and liquids, formed within said bonding material that span fromsaid semiconductor device to said substrate, wherein a percentage ofsaid plurality of amoebiform spaces within said bonding material is 5%to 70%; and wherein said spaces change shape in response to deformationof at least one of said substrate and said semiconductor device.
 7. Asemiconductor device connecting structure as defined in claim 6, whereinthe percentage of said plurality of amoebiform spaces within saidbonding material is 10% to 30%.
 8. A semiconductor device connectingstructure for connecting a semiconductor device onto a substrate,comprising: a bonding layer interposed between said semiconductor deviceand said substrate to accomplish adhesion therebetween, said bondinglayer having an action to absorb deformation of said semiconductordevice or said substrate by absorbing said deformation with a pluralityof amoebiform spaces substantially free from solids and liquids, thatspan from said semiconductor to said substrate, said spaces changingshape in response to deformation of at least one of said substrate andsaid semiconductor device.
 9. A semiconductor device connecting methodfor connecting a semiconductor device onto a substrate, comprising thesteps of: interposing a bonding layer between said semiconductor deviceand said substrate to accomplish adhesion therebetween; joining saidsubstrate and said semiconductor device to each other by pressing apressurizing head against said semiconductor device to pressurize saidbonding layer, said pressurizing head being heated in order to also heatsaid bonding layer; forming a plurality of spaces substantially freefrom solids and liquids, that span from said semiconductor device tosaid substrate closely to each other within said bonding layer bydecreasing a viscosity of a bonding material of said bonding layer tocause said bonding layer to flow outward from said semiconductor device;and absorbing deformation of said semiconductor device or said substratewith said plurality of spaces, said spaces changing shape in response todeformation of at least one of said substrate and said semiconductordevice.
 10. A semiconductor device connecting method as defined in claim9, wherein said bonding material is made of an epoxy-based bondingmaterial.
 11. A liquid crystal display unit comprising: a pair of liquidcrystal holding substrates disposed in an opposed relation to each otherwith liquid crystal therebetween; a semiconductor device connected ontoat least one of said liquid crystal holding substrates; and a bondinglayer interposed between said at least one liquid crystal holdingsubstrate and said semiconductor device to accomplish adhesiontherebetween, wherein said bonding layer includes a bonding material foradhering said semiconductor device onto said liquid crystal holdingsubstrate and a plurality of amoebiform spaces substantially free fromsolids and liquids, formed within said bonding material that span fromsaid semiconductor device to said substrate; wherein said spaces changeshape in response to deformation of at least one of said at least oneliquid crystal holding substrate and said semiconductor device.
 12. Aliquid crystal display unit as defined in claim 11, wherein saidsemiconductor device includes a plurality of bumps arranged in rows. 13.A liquid crystal display unit as defined in claim 11, wherein saidplurality of amoebiform spaces are placed closely to each other.
 14. Aliquid crystal display unit as defined in claim 11, wherein said bondingmaterial is an anisotropic conductive film including conductiveparticles dispersed into a resin film.
 15. A liquid crystal display unitas defined in claim 11, wherein the percentage of said plurality ofamoebiform spaces within said bonding material is 5% to 70%.
 16. Aliquid crystal display unit as defined in claim 15, wherein thepercentage of said plurality of amoebiform spaces within said bondingmaterial is 10% to 30%.
 17. An electronic apparatus having a pluralityof semiconductor driving output terminals and a liquid crystal displayunit connected to said semiconductor driving output terminals, whereinsaid liquid crystal display unit includes: a pair of liquid crystalholding substrates disposed in an opposed relation to each other withliquid crystal therebetween; a semiconductor device connected onto atleast one of said liquid crystal holding substrates; and a bonding layerinterposed between said at least one liquid crystal holding substrateand said semiconductor device to accomplish adhesion therebetween,wherein said bonding layer includes a bonding material for adhering saidsemiconductor device onto said at least one liquid crystal holdingsubstrate and a plurality of amoebiform spaces substantially free fromsolids and liquids, formed within said bonding material that span fromsaid semiconductor device to said liquid crystal holding substrate, saidspaces changing shape in response to deformation of at least one of saidat least one liquid crystal holding substrate and said semiconductordevice.
 18. A semiconductor device connecting structure comprising: asubstrate; a semiconductor device connected to the substrate; and abonding layer interposed between the substrate and the semiconductordevice, the bonding layer including a bonding material adhering thesemiconductor device to the substrate, a plurality of conductiveparticles dispersed in the bonding material, and a plurality ofamoebiform spaces substantially free from solids and liquids, formedwithin the bonding material that span from the semiconductor device tothe substrate, wherein the semiconductor device is adhered to thesubstrate by the bonding material at a substantially plane centerportion of the semiconductor device; and wherein the spaces change shapein response to deformation of at least one of the substrate and thesemiconductor device.
 19. A liquid crystal display comprising: asubstrate; a liquid crystal on the substrate; a plurality of electrodeson the substrate; a semiconductor device having a plurality of bumps,the semiconductor device being mounted on the substrate, each bump beingconnected to one of the plurality of electrodes; a bonding layerinterposed between the substrate and the semiconductor device, thebonding layer including a bonding material adhering the semiconductordevice to the substrate, and a plurality of amoebiform spacessubstantially free from solids and liquids, formed within the bondingmaterial that span from the semiconductor device to the substrate,wherein the plurality of amoebiform spaces are at least formed in anarea encompassed by the plurality of electrodes; and wherein the spaceschange shape in response to deformation of at least one of the substrateand the semiconductor device.
 20. A liquid crystal display comprising: asubstrate; a liquid crystal on the substrate; a semiconductor devicemounted on the substrate, the semiconductor device including a peripherydefining a mounting area; a bonding layer interposed between thesubstrate and the semiconductor device, the bonding layer including abonding material adhering the semiconductor device to the substrate, anda plurality of amoebiform spaces substantially free from solids andliquids, formed within the bonding material that span from thesemiconductor device to the substrate, wherein the plurality ofamoebiform spaces are at least formed in the mounting area; and whereinthe spaces change shape in response to deformation of at least one ofthe substrate and the semiconductor device.
 21. A liquid crystal displayaccording to claim 20, wherein a region occupied by the bonding layer islarger than the mounting area.
 22. A liquid crystal display comprising:a substrate; a liquid crystal on the substrate; a plurality ofelectrodes on the substrate; a semiconductor device having at least twoedges opposing each other, and a plurality of bumps aligned along atleast said two edges, the semiconductor device being mounted on thesubstrate, each bump being connected to an electrode; a bonding layerinterposed between the substrate and the semiconductor device, thebonding layer including a bonding material adhering the semiconductordevice to the substrate, and a plurality of amoebiform spacessubstantially free from solids and liquids, formed within the bondingmaterial that span from the semiconductor device to the substrate,wherein the amoebiform spaces are at least formed in an area bordered bythe electrodes; and wherein the spaces change shape in response todeformation of at least one of the substrate and the semiconductordevice.
 23. A liquid crystal display comprising: a first substrate; asecond substrate including an overlapping area overlapping the firstsubstrate; a plurality of electrodes formed on the first substrate, eachof the plurality of electrodes at least extending toward the overlappingarea; a semiconductor device having a plurality of bumps, thesemiconductor device being mounted on the first substrate, each bumpbeing connected to one of the plurality of electrodes; a bonding layerinterposed between the first substrate and the semiconductor device, thebonding layer including a bonding material adhering the semiconductordevice to the first substrate, and a plurality of amoebiform spacessubstantially free from solids and liquids, formed within the bondingmaterial that span from the semiconductor device to the first substrate,wherein the plurality of amoebiform spaces are at least formed in anarea encompassed by the bumps; and wherein the spaces change shape inresponse to deformation of at least one of the first substrate and thesemiconductor device.
 24. A semiconductor device connecting structurecomprising: a substrate; a semiconductor device connected to thesubstrate; and a bonding layer including a bonding material that joinsthe semiconductor to the substrate and a plurality of amoebiform spacessubstantially free from solids and liquids, disposed in the bondingmaterial that span from the semiconductor device to the substrate, thebonding layer being disposed between the substrate and the semiconductordevice, wherein the semiconductor device is adhered to the substratewith the bonding material which is positioned between adjacent ones ofthe plurality of amoebiform spaces; and wherein the spaces change shapein response to deformation of at least one of the substrate and thesemiconductor device.
 25. A semiconductor device comprising: a firstsubstrate having an upper surface; a semiconductor device having a lowersurface opposing the upper surface of the first substrate; and aresinous bonding layer interposed in a gap between the lower surface ofthe device and the upper surface of the substrate, the bonding layerhaving a plurality of conductive particles therein for making anelectrical connection between the substrate and the device, the bondinglayer being formed under sufficient heat and pressure to create amultiplicity of discrete irregularly shaped resin free spacessubstantially free from solids and liquids, spanning an entirety of thegap between the device and the substrate, the spaces being separatedfrom one another by adjacent regions of resinous material also spanningthe gap; wherein the bonding layer deforms to accommodate relativemovement of the device and substrate; and wherein the spaces changeshape in response to deformation of at least one of the substrate andthe semiconductor device.
 26. A liquid crystal display unit comprising:a pair of liquid crystal holding substrates disposed in an opposedrelation to each other with a liquid crystal therebetween; asemiconductor device connected onto at least one of said liquid crystalholding substrates; and a resinous bonding layer interposed in a gapbetween a lower surface of said device and an upper surface of said atleast one liquid crystal holding substrate, said bonding layer having aplurality of conductive particles therein for making an electricalconnection between said at least one liquid crystal holding substrateand said device, said bonding layer being formed under sufficient heatand pressure to create a multiplicity of discrete irregularly shapedresin free spaces substantially free from solids and liquids, spanningan entirety of said gap between said device and said at least one liquidcrystal holding substrate, said spaces being separated from one anotherby adjacent regions of resinous material also spanning said gap; whereinsaid bonding layer deforms to accommodate relative movement of saiddevice and said at least one liquid crystal holding substrate; andwherein said spaces change shape in response to deformation of at leastone of said at least one liquid crystal holding substrate and saidsemiconductor device.